Pixel 9 leak reveals Tensor G4 specs and benchmarks

The leaked Pixel 9, 9 Pro and 9 Pro XL have been photographed and have now undergone their first benchmarks, while we now have details of the Tensor G4.

According to the results of standardized tests by rosetkd,Tensor G4 has a 1+3+4 core configuration, with Cortex-X4 acting as the primary core/pioneer. It is followed by three medium Cortex-A720 cores and four small Cortex-A520 cores.

The original Tensor and G2 had a basic 2+2+4 configuration, while the G3 switched to 1+4+4. Here is the historical comparison:

Spanner	Spanner G2	Spanner G3	Spanner G4
2x Cortex-X1 (2,8 GHz)	2x Cortex-X1 (2,85 GHz)	1x Cortex-X3 (2,91 GHz)	1x Cortex-X4 (3,1 GHz)
2x Cortex-A76 (2,25 GHz)	2x Cortex-A78 (2,35 GHz)	4x Cortex-A715 (2,37 GHz)	3x Cortex-A720 (2,6 GHz)
4x Cortex-A55 (1,8 GHz)	4x Cortex-A55 (1,8 GHz)	4x Cortex-A510 (1,7 GHz)	4x Cortex-A520 (1,95 GHz)

With Cortex-X4 (which Snapdragon 8 Gen 3 uses), Arm chased 15% performance increase and 40% better energy efficiency than the previous generation.

On the A720 beforeCompared to its predecessor, energy efficiency has increased by 20%, while the A510 has similarly increased by 22%.

These devices are not running the final software, and still have months of optimization and fine-tuning left You should keep this in mind when looking at the AnTuTu benchmarks for the Tensor G4 in the Pixel 9 series. There are some performance improvements with the Pixel 8 for comparison.

Pixel 8: 877443 points
Pixel 9 (Tap): 1.016.167
Pixel 9 Pro (Cayman): 1.148.452
Pixel 9 Pro XL (Comodo): 1.176.410

With the Tensor G5 in the Pixel 10 expected to go to TSMC, the Pixel 9 and the Samsung-made chip could be a big star for buyers this year. Previous leaks have said that the Tensor G4 will use Samsung’s latest 4nm process and packaging method. FOWLP (Fan-Out Wafer Level Packaging) is intended to further improve thermal management and energy efficiency.

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