MediaTek has the new SoC Dimension 8400 for the mid-to-high-end smartphone segment Presented. The chip’s special feature is the “All Big Core” architecture with eight powerful ARM Cortex-A725 CPU cores clocked at up to 3.25 GHz. Unlike the typical Big.Little architecture, which combines energy-efficient and powerful cores, MediaTek relies exclusively on high-performance cores.
Compared to its predecessor, the Dimension 8300, MediaTek promises 41 percent higher multitasking performance with up to 44 percent lower peak consumption. The Arm Mali-G720 GPU has also been optimized and offers up to 24 percent increased performance and 42 percent improved energy efficiency, according to the data sheet.
The integrated NPU 880 is intended to enable advanced AI applications and supports the latest generative AI models. The predecessor was already aiming to run local models. MediaTek also integrates the “Dimension Agentic AI Engine”, which was already found in the Dimension 9400, which was unveiled a few months ago.
Mediatech explained like this:
Agent-based AI is an AI system that is autonomous to a certain extent. Unlike reactive AI, which responds to specific inputs or predefined tasks, agent-based AI has a certain level of autonomous perception, interpretation, and response. The MediaTek Dimension NPU 890’s Dimension Agentic AI Engine (DAE) enables AI agents to operate in a hybrid framework of edge and cloud collaboration. These intelligent agents are able to interpret the context of your behavior and intentions and not only advise you, but also take direct action on your behalf and even work across applications to complete tasks independently and much faster.
Mediatek (machine translated)
The Dimension 8400 supports displays with refresh rates up to 144 Hz as well as resolutions up to WQHD+ in dual-screen configurations. Cameras with resolutions up to 320 MP can be attached, and HDR video recording is possible across the entire zoom range.
With the new chip, MediaTek wants to strengthen its position in the premium segment and compete against Qualcomm’s new Snapdragon chip. The first smartphone with the Dimension 8400, possibly the Redmi Turbo 4, is expected to hit the market in early 2025. Given MediaTek’s growing presence in smartphones from various manufacturers, we’ll likely see it in some other devices as well.
