AMD Ryzen 7000 CPU Introduces Delidding IHS and Zen 4 Gold Plated CCD with High Quality TIM
The omitted CPU is part of the Ryzen 9 family as it has two chips and we know that the CCD configuration is only for the Ryzen 9 7950X and Ryzen 9 7900X. The chip has a total of three molds, two of which are the aforementioned AMD Zen 4 CCD built on a 5nm process node, then we have the larger chip around the middle which is the IOD which is node based on the 6th -nm process. The AMD Ryzen 7000 CCD measures a die size of 70mm2 compared to 83mm2 for the Zen 3 and has a total of 6.57 billion transistors, a 58% increase over the Zen 3 CCD’s 4.15 billion transistors.
Scattered throughout the case are many SMDs (capacitors/resistors) which are usually located below the core tape layer when we consider Intel CPUs. Instead, AMD projected it to the upper layer and so had to design a new type of IHS, known internally as Octopus. we have I’ve seen IHS Plucked before But now we see a final production slide without a cover to cover those Zen 4 gold nuggets!
With this in mind, the IHS is an interesting component of the AMD Ryzen 7000 desktop CPU. Eight weapon layouts are shown in a single image Robert Hallock “AMD Technical Marketing Director” refers to “Octopus”. Below each arm is a small TIM applique used for medium IHS welding. Now the chip will be really hard to discharge because each arm is next to a huge array of capacitors. Each arm is raised slightly to make room for SMDs and users don’t have to worry about heat traps underneath.
AMD Ryzen 7000 desktop CPU removed (Image credit: GamersNexus):
Der8auer also made a statement about the upcoming unveiling of the work-in-progress AMD Ryzen 7000 desktop CPUs at Gamer Nexus, and seems to explain why the new CPUs have gold-plated CCDs:
Regarding gold plating, there is one aspect where you can solder indium to gold without flux. This makes the process easier and doesn’t require harsh chemicals on your CPU. It is theoretically possible to solder silicon to copper without gold plating, but this becomes more difficult and requires flux to break down the oxide layers.
From Der8auer to GamersNexus
The most interesting area of the AMD Ryzen 7000 desktop CPU IHS, aside from the arms, is the gold-plated IHS, which is used to increase heat dissipation from the CPU/IO die and directly to the IHS. The 5nm and 6nm Zen 4 CCDs have TIM liquid metal or thermal interface material for good thermal conductivity, and the aforementioned gold plating helps a lot with heat dissipation. Whether or not the capacitors will have a silicon coating remains to be seen, but from the previous packaging shot it looks like yours.
It is also reported that the smaller surface area of the IHS means it will be more compatible with existing circular and square cold plate coolers. Square-shaped cold slabs would be the preferred choice, but circular panels would also work well. Noctua also highlighted the issue TIM implementation method They recommend users to move the single point mode to the middle of the IHS for AMD AM5 CPUs.
AMD Ryzen 7000 Desktop CPU Renders (with/without IHS):
Also worth noting is that every Gen 4 CCD is very close to the IHS edge, which wasn’t necessarily the case with previous Gen CPUs. So not only will it be very difficult to unpack, but the core will mostly be an IO die, which means that cooling equipment for such chips must be ready. AMD Ryzen 7000 desktop CPUs were introduced in the fall of 2022 on the AM5 platform. This chip can do it Up to 5.85GHz up to 230W power supply So every bit of cooling is a must for overclockers and enthusiasts.
Comparison of AMD desktop CPU generations:
|AMD CPU family||symbolic name||processor process||Processor Cores/Threads (Maximum)||TDPs (Maximum)||an activity||Slide the podium||Memory support||PCIe support||publication|
|Ryzen 1000||Summit Ridge||14 nanometers (gen 1)||8/16||95 watts||AM4||300er series||DDR4-2677||Generation 3.0||2017|
|Ryzen 2000||Summit Ridge||12 Nanometer (Zen+)||8/16||105 W||AM4||400. Seri||DDR4-2933||Generation 3.0||2018|
|Ryzen 3000||Mattis||7 nanometers (gen 2)||16/32||105 W||AM4||500. Series||DDR4-3200||Generation 4.0||2019|
|Ryzen 5000||Vermeer||7 nanometers (gen 3)||16/32||105 W||AM4||500. Series||DDR4-3200||Generation 4.0||2020|
|Ryzen 5000 3D||Warhol?||7 nm (Gen 3D)||8/16||105 W||AM4||500. Series||DDR4-3200||Generation 4.0||2022|
|Ryzen 7000||Raphael||5 nm (gen 4)||16/32||170 watts||AM5||600. Series||DDR5-5200||General 5.0||2022|
|Ryzen 7000 3D||Raphael||5 nm (gen 4)||16/32?||105-170 watts||AM5||600. Series||DDR5-5200/5600?||General 5.0||2023|
|Ryzen 8000||Granite burr||3nm (Zen5)?||will be announced||will be announced||AM5||700er series?||DDR5-5600+||General 5.0||2024-2025?|