Dell used CAMM as a replacement for SO-DIMMs in its first notebooks in 2022. The new memory modules are screwed in rather than plugged in and are much flatter. JEDEC has now adopted the standard as CAMM2. Other manufacturers are expected to use it from 2024.
The Dell Precision 7670 and 7770 workstation notebooks, introduced in 2022, feature compression attached memory modules (CAMM) for the first time. Serve as they are Replacing the standard used for over 25 years Small Outline Dual Inline Memory Module (SO-DIMM).
Finalization of the standard has been completed
JEDEC, a US semiconductor standardization organization, is now approaching the end of 2023 Dell’s memory format became the next RAM module standard for notebooks Made in early 2023, Dell engineer and CAMM co-developer Tom Schell, who is also a member of the JEDEC committee, had a statement about the plan. Approximately 20 companies in the JEDEC Working Group have CAMM as the new standard Adopted unanimouslyShell said. Notebooks with the CAMM version, slightly adapted by JEDEC, are scheduled to launch in 2024 So SO-DIMM is expected to gradually disappear from the notebook market from 2024 onwards. The SO-DIMM successor is now called Ultimate CAMM2.
Screwed rather than plugged or soldered
In CAMM, the RAM is screwed to a contact strip and not soldered, as is often the case with flat notebooks. According to Dell, a CAMM is 128 GB 57 percent thinner Four SO-DIMMs are inserted with a total of 128 GB This gives notebook manufacturers additional space, for example for larger cooling solutions.
is a module Only 2.85 mm high, but two CAMM2s can also be stacked – then 7.5 mm height space is required. Dell’s previous modules were significantly larger than SO-DIMMs, but flatter. Samsung had a more compact one in September LPCAMM-Variant The final JEDEC specification presented calls for 78 millimeters in length and 29.6 to 68 millimeters in width. Capacity varies from 8 to 128 GB per module. Value should come later Also on desktop PCs Used.
Data paths are shorter in CAMM format High clock frequency Active SO-DIMMs are currently limited to 32 GB per module and 6,400 MHz (DDR5). CAMM enables a CPU connection via 128 data lanes Dual-channel operation with only one module. There is, however Single-channel modules are also possible, which is why two CAMM2s can be stacked on top of each other. Incidentally, in the second half of 2024, Micron intends to deliver LPCAMM2 with 8,533 MT/s and 16 to 128 GB.
It remains to be seen which manufacturers besides Dell will present notebooks with the new RAM standard at CES. Meanwhile, Intel apparently plans to solder the RAM directly into the Lunar Lake generation processor chips. Whether CAMM2 can be victorious remains to be seen.
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